Peb Siv ntawm MicroLED

MicroLED tam sim no paub peb cov txheej txheem thiab yuav tsum tau siv cov kev ua yeeb yam thev xaib tshaj plaws

Cov txheej txheem MicroLED tau muab faib ua cov ntiv tes choj vias epitaxial welding thiab zaj duab xis hloov raws li txoj kev siv sib txawv:

Chip-bonding (LED chip bonding): LED yog ncaj qha mus txiav rau micro-scale MicroLED chips, thiab ces SMT tshuab los yog COB tshuab siv los txuas MicroLED chips ib los ntawm ib qho rau cov duab substrate.

Epitaxial wafer bonding: Inductively Coupled Plasma Ion Etching (ICP) nyob rau hauv zaj duab xis epitaxial thin txheej ntawm ib qho LED ncaj qha los ntawm micro-scale micro-LED epitaxial nyias zaj duab xis, thiab ces LED wafer (nrog rau txheej txheej epitaxial thiab cov substrate) Ncaj ncaj qha mus rau cov tsav tsheb nqaj hlau, thiab thaum kawg lub substrate stripped siv lub cev los yog tshuaj mechanism, tawm tsuas yog cov Micro-LED epitaxial nyias zaj duab xis ntawm tus tsav Circuit Court substrate rau daim ntawv tso tawm.

Hloov zaj duab xis zaj duab xis: Micro-theem MicroLED epitaxial nyias zaj duab xis qauv yog ua los ntawm cov tawv nqaij tawm ntawm cov hluav taws xob substrate coj los ua ib cov yeeb yaj kiab hlau thaig nrog ib ntu substrate thiab ces inductively coupled plasma etching; los yog siv inductively coupled ntshav ion etching rau ib micron-qhov haum MicroLED epitaxial nyias zaj duab xis. Cov qauv, los ntawm cov xaim hluav taws xob tawm ntawm lub substrate, ua rau cov qauv thev naus laus zis ntawm lub thev naus laus zis los ntawm ib ntus substrate.

Daim duab: microLED ntau txoj kev siv tshuab

Tam sim no, microLED daim ntawv tshuaj ntsuam loj uas muaj suab npe los ntawm Sony tsuas yog txais kev ntiv tes choj vuam txujci; thaum Apple yog txhawb nqa thin-film hloov tshuab, uas yog tsim rau me me thiab medium-loj qhia. Ntawm no peb tsuas yog nthuav qhia cov ntaub ntawv tawm suab paj nruag uas Kua yuav txais yuav: MicroLED zaj duab xis hloov tshuab siv tau yooj yim piav raws li 1) MicroLED chip preparation; 2) MicroLED nti xa mus; 3) Dhau lub TFT substrate thiab tus tsav tsheb tsav IC kom tiav cov pob khoom.

MicroLED nti npaj, qhov txheej txheem ntawm tus txheej txheem yog qhov sib

Kev npaj ntawm MicroLED chips yog zoo li cov ntawm cov tsoos LED chips. Lub thawv xiav-ntsuab teeb tsuas yog siv los ua piv txwv txog kev tsim ntau lawm: LED chips yog tsim los ntawm kev ua cov txheej txheem xws li PSS qauv substrate, LED kev loj hlob, thiab nti ua rau ntawm sapphire substrate khoom. MicroLED chips muaj ntau me me (ob peb microns) loj tshaj cov teeb meem zoo li qub, tiam sis cov tshuab ua haujlwm uas twb muaj lawm muaj peev xwm tswj tau cov micrometer-level chips kom tiav, thiab tsis muaj kev cuam tshuam zoo heev. Cov nram no yog ib nyuag taw qhia rau txhua qhov txuas ntawm LED nti kev loj hlob:

Sapphire substrate kev loj hlob epitaxial wafer (xiav-ntsuab LED nti)

Ua ntej, cov khoom siv sapphire yog qauv ntawm PSS substrate. Lub hom phiaj ntawm cov kauj ruam no yog xav paub ntau yam reflections ntawm lub teeb nyob rau hauv lub substrate los ntawm etching ib tug tsis tu ncua txheej txheem ntawm nyob rau ntawm lub sapphire substrate thiaj li mus cuag lub teeb sab nraud extraction ntawm nti. Lub teeb ci. Tom qab ntawd, ib qho tsis muaj txheej txheem (U-GaN), ib qho N-hom roj nitrium (N-GaN), muaj txheej txheem (MQWs, ntau quantum zoo), thiab P-hom gallium nitride txheej (P-GaN) zus zus zus ntawm PSS txheej. ).